| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in workability and adhesiveness, having satisfactory mechanical strength after curing and excellent in heat resistance, to provide a photosensitive dry film resist using the composition and to provide a photosensitive cover lay film laminated board obtained by laminating the dry film resist on a printed board and exhibiting good solid state properties. SOLUTION: The photosensitive resin composition contains (A) a soluble polyimide having a COOH equivalent of 200-3,000, (B) a polyfunctional (meth) acrylic compound and/or its analogue and (C) a photoreaction initiator. |
