发明名称 |
SLURRY, POLISHING FLUID SET, POLISHING FLUID, AND SUBSTRATE POLISHING METHOD USING SAME |
摘要 |
The slurry of the invention comprises abrasive grains and water, wherein the abrasive grains include tetravalent cerium hydroxide particles and produce light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with the content of the abrasive grains adjusted to 1.0 mass %. The polishing liquid of the invention comprises abrasive grains, an additive and water, wherein the abrasive grains include tetravalent cerium hydroxide particles and produce light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with the content of the abrasive grains adjusted to 1.0 mass %. |
申请公布号 |
KR20120081196(A) |
申请公布日期 |
2012.07.18 |
申请号 |
KR20127011959 |
申请日期 |
2011.01.20 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
IWANO TOMOHIRO;AKIMOTO HIROTAKA;NARITA TAKENORI;KIMURA TADAHIRO;RYUZAKI DAISUKE |
分类号 |
B24B37/00;B24B37/04;C09K3/14;H01L21/304 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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