发明名称 |
Wiring board and method for manufacturing the same |
摘要 |
A wiring board has a conductive pattern, an electronic component connected to the conductive pattern by means of a via hole, and a substrate where the electronic component is built into. The connection interface between the via hole and the electronic component inclines toward the connection interface between the via hole and the conductive pattern. |
申请公布号 |
US8222539(B2) |
申请公布日期 |
2012.07.17 |
申请号 |
US20090490409 |
申请日期 |
2009.06.24 |
申请人 |
KAWAMURA YOICHIRO;SHIMIZU KEISUKE;IBIDEN CO., LTD. |
发明人 |
KAWAMURA YOICHIRO;SHIMIZU KEISUKE |
分类号 |
H05K1/11 |
主分类号 |
H05K1/11 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|