| 发明名称 |
Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit |
| 摘要 |
According to one mode of the present invention, metal-containing resin particles composed of a resin containing 50 wt % or more of a thermosetting resin and having a ratio of weight of absorbed moisture to weight of resin from 500 to 14500 ppm, and fine metal particles contained in said resin, is provided. |
| 申请公布号 |
US8220147(B2) |
申请公布日期 |
2012.07.17 |
| 申请号 |
US20090541568 |
申请日期 |
2009.08.14 |
| 申请人 |
YAMAGUCHI NAOKO;AOKI HIDEO;TAKUBO CHIAKI;KABUSHIKI KAISHA TOSHIBA |
发明人 |
YAMAGUCHI NAOKO;AOKI HIDEO;TAKUBO CHIAKI |
| 分类号 |
G03G9/08;H05K3/02;B32B3/00;G03G9/087;H01K3/00;H01K3/22;H01L21/00;H01L21/02;H01L21/027;H01L23/12;H01L23/498;H05K1/09;H05K3/10;H05K3/12;H05K3/24;H05K3/46 |
主分类号 |
G03G9/08 |
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