| 摘要 |
<p>A method of making an abrasive article for wafer planarization, the method comprising providing an abrasive coating composition, providing a backing having a first major surface, said surface having a first portion and a second portion, and bringing the backing into contact with the abrasive coating composition, so that the abrasive coating composition substantially adheres only to the first portion of the backing.</p> |
| 申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
MUILENBURG, MICHAEL, J.;KIM, CHONG, YONG;FIZEL, JERRY, J.;WEBB, RICHARD, J.;GAGLIARDI, JOHN, J.;PENDERGRASS, DANIEL, B.;STREIFEL, ROBERT, J.;BRUXVOORT, WESLEY, J. |
