THERMAL CONVECTION, HEAT HEAT CONDUCTION SINK STRUCTURE FOR ELECTRONIC APPLIANCE

摘要

PURPOSE: A heat sink structure for thermal convection and heat conduction type electronic appliances is provided to simplify manufacturing processes by integrating a heat conductive plate with the lower side of the upper board of an electronic appliance. CONSTITUTION: A heat sink(10) includes the following: a plate-shaped base(11) is adjacently arranged to the upper side of a main board(2); a plurality of heat radiating fins(12) is protruded from the upper side of the base; a heat conductive plate(20) is attached to the lower side of the upper board of an electronic appliance(1); the heat conductive plate sucks heat conducted from the main board along the heat radiating fins; and the sucked heat is radiated to the external side of the electronic appliance.