| 摘要 |
PURPOSE: A conductive paste is provided to easily form micropattern, and to obtain a printed circuit board with excellent thermal resistance, corrosion resistance, adhesion reliability, and flexability. CONSTITUTION: A conductive paste composition comprises a silver powder, a bisphenol A type epoxy resin having equivalent ratio of 1000-3000 as an organic binder, an acid anhydride based compound as a hardener, and a solvent. A manufacturing method of the conductive paste composition comprises a step of manufacturing organic vehicle by mixing bisphenol A based epoxy resin solvent, and acid anhydride based compound; and a step of mixing silver powder and the organic vehicle, and dispersing the silver powder.
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