| 摘要 |
PURPOSE: A chip junction apparatus is provided to accurately weld a first chip and a second ship to a substrate by sensing the alignment of the first chip and the second chip through a first sensor unit and a second sensor unit. CONSTITUTION: A body unit(100) supports a substrate. A first transport unit(400) loads a first chip on the substrate. A second transport unit(500) loads a second chip on the substrate. A first sensor unit(200) senses the alignment of the first chip. The first sensor unit senses a 3dimensional image of an edge portion of the first chip. The first chip is formed into a polygon shape. A second sensor unit(300) senses the alignment of the second chip. A first tinting unit tilts the first chip in a first direction. A second tilting unit tilts the first chip in a second direction.
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