发明名称 DEVICE FOR TAKING IN IMAGE IN BEAD REGION IN WELDING MATERIAL
摘要 <P>PROBLEM TO BE SOLVED: To provide a device which can take in an image usable in the determination of a hole defect of a bead region in the whole of a first half and a latter half of a welding process. <P>SOLUTION: This device 1 comprises a laser irradiation part 3, a laser irradiation control part 4, a monitoring part 5, a storage part 6 and an image take-in part 7. In the laser irradiation control part 4, there are set the information of a main welding portion from a welding start point B up to a welding finish point C, and the information of a preliminary welding portion located in a position approximate to the welding start point B, the laser irradiation part 3 is configured such that the preliminary welding portion is irradiated with a welding laser before starting welding from the welding start point B, and the image take-in part 7 acquires the image of the bead region from the welding start point B up to the welding finish point C. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012130939(A) 申请公布日期 2012.07.12
申请号 JP20100284818 申请日期 2010.12.21
申请人 SUZUKI MOTOR CORP 发明人 ISHIDA HIDENOBU
分类号 B23K26/00;B23K26/20 主分类号 B23K26/00
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