发明名称 ELECTRONIC COMPONENT ATTACHMENT DEVICE, AND ELECTRONIC COMPONENT ATTACHMENT METHOD
摘要 <P>PROBLEM TO BE SOLVED: To enhance production efficiency by reducing waste of panels, split substrates and components during production when a panel component is attached, as a cell, on a mother board or when a component is attached on a split substrate. <P>SOLUTION: When the residual number of components being fed from all component supply units goes above a fixed threshold, suction/attachment operation of components is carried out in an optimization mode for minimizing the time of component suction/attachment operation over the entire substrate. When the residual number of components being fed from any component supply unit goes below the fixed threshold, suction/attachment operation of components is carried out in a sequence mode for carrying out the component suction/attachment operation continuously from start to finish for some part of the substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012134303(A) 申请公布日期 2012.07.12
申请号 JP20100284745 申请日期 2010.12.21
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 IMOTO TAKUYA;IIDA SHIGERU;IZUMIHARA KOICHI
分类号 H05K13/04 主分类号 H05K13/04
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