发明名称 METHOD FOR FORMING RESIST PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To form a resist pattern with high resolution using immersion exposure, while preventing degeneration of a resist film during immersion exposure using various kinds of immersion liquids including water as well as preventing degeneration of the immersion liquid used, without increasing the number of processes, in an immersion exposure process, particularly, an immersion exposure process that increases resolution of a resist pattern by exposing a resist film while allowing a liquid of a predetermined thickness having a refractive index higher than that of air and lower than that of the resist film, to be present at least on the resist film in the route of lithography exposure light to reach the resist film. <P>SOLUTION: A protective film having such characteristics as having substantially no compatibility with a liquid, particularly water, in which a resist film is to be immersed, and being soluble with an alkali, is formed on the surface of the resist film to be used. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012133395(A) 申请公布日期 2012.07.12
申请号 JP20120055267 申请日期 2012.03.13
申请人 TOKYO OHKA KOGYO CO LTD 发明人 ISHIZUKA KEITA;WAKIYA KAZUMASA;ENDO KOTARO;YOSHIDA MASAAKI
分类号 G03F7/11;C08F14/18;G03F7/38;H01L21/027 主分类号 G03F7/11
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