发明名称 |
CIRCUIT BOARD MOUNT STRUCTURE AND METHOD FOR MULTILAYER CERAMIC CAPACITOR, LAND PATTERN OF CIRCUIT BOARD, AND PACKAGE AND ALIGNMENT METHOD FOR MULTILAYER CERAMIC CAPACITOR |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide circuit board mount structure and mount method for a multilayer ceramic capacitor that can reduce the noise generated by vibration due to a piezoelectric phenomenon, a land pattern of a circuit board for the same, and the like. <P>SOLUTION: In mount structure where a multilayer ceramic capacitor 10 including a stack of dielectric sheets 11 having internal electrodes 12 and including external terminals 14a and 14b connected in parallel to the internal electrode 12 at both ends is mounted on a circuit board 20, an internal electrode layer of the multilayer ceramic capacitor 10 and a concave substrate are disposed in a horizontal direction, the external terminal electrodes 14a and 14b and a land of the circuit board 20 are electrically connected, and the height (T<SB POS="POST">s</SB>) of a conductive material 15 that electrically connects the external terminal electrodes 14a and 14b and the land is less than 1/3 of the thickness (T<SB POS="POST">MLCC</SB>) of the multilayer ceramic capacitor 10. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012134498(A) |
申请公布日期 |
2012.07.12 |
申请号 |
JP20110276870 |
申请日期 |
2011.12.19 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
AHN YON-GYU;YI BYON-HWA;PARK MN-CHOL;PARK SAN-SOO;PARK DON-SEOK |
分类号 |
H01G4/30;H01G2/06;H01G4/12;H01G13/00;H05K1/18;H05K3/34;H05K13/02;H05K13/04 |
主分类号 |
H01G4/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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