发明名称 SEMICONDUCTOR STORAGE DEVICE, SEMICONDUCTOR WAFER AND SEMICONDUCTOR STORAGE DEVICE MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor storage device, a semiconductor wafer and a semiconductor storage device manufacturing method, which make alignment marks be easily identifiable, and thereby enhancing mask alignment accuracy. <P>SOLUTION: According to an embodiments, a semiconductor storage device including a memory cell array part and an alignment mark part juxtaposed to the memory cell array part is provided. The memory cell array part includes a first memory string, a second memory string and an element isolation insulator layer. The first and second memory strings are provided on a principal surface of a semiconductor layer. The element isolation insulator layer isolates the first and second memory strings. The alignment mark part includes a mark part semiconductor layer and a mark part insulator layer. The mark part semiconductor layer is a part of the above-described semiconductor layer. The mark part insulator layer includes the same material as the material used for the element isolation insulator layer. A top face of the mark part semiconductor layer is included in a plane different from a plane including a top face of the mark part insulator layer. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012134425(A) 申请公布日期 2012.07.12
申请号 JP20100287480 申请日期 2010.12.24
申请人 TOSHIBA CORP 发明人 SHIMOIDE KOJI
分类号 H01L27/115;H01L21/336;H01L21/8247;H01L27/10;H01L29/788;H01L29/792 主分类号 H01L27/115
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