发明名称 |
LIGHT EMITTING DIODE PACKAGE |
摘要 |
A light emitting diode package includes a base, a chip mounted on the base, and an encapsulant layer encapsulating the chip. The encapsulant layer includes a light exit face for light generated generated by the chip transmitting through. A plurality of microstructures are formed on the light exit face. Distribution of the microstructures has the following characters: a density of the microstructures is inversely proportional to a light intensity of the light at the light exit face; and a size of the microstructures is inversely proportional to the light intensity of the light at the light exit face. |
申请公布号 |
US2012175656(A1) |
申请公布日期 |
2012.07.12 |
申请号 |
US201113287224 |
申请日期 |
2011.11.02 |
申请人 |
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. |
发明人 |
FANG JUNG-HSI;HSU SHIH-YUAN |
分类号 |
H01L33/60 |
主分类号 |
H01L33/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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