SEMICONDUCTOR PACKAGE AND METHODS OF FABRICATING THE SAME

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to reduce the electrical resistance by using a connecting member like a bonding clip. CONSTITUTION: A substrate includes separated conductive patterns(111,113). Semiconductor chips(120) are mounted on the conductive patterns. A connecting member(130) electrically connects between the conductive patterns or between the semiconductor chips or between the conductive pattern and the semiconductor chip. A sealing member(160) covers the substrate, the semiconductor chips and the connecting member. The lower surface of the substrate and the upper surface of the connecting member are exposed from the sealing member.