| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a through wiring substrate manufacturing method capable of electrically connecting electrodes between mounted devices at a high degree of freedom, even in a small device, in which electrode arrangement of devices mounted on both faces of a through wiring substrate is various and highly dense. <P>SOLUTION: A through wiring substrate comprises a substrate 11 having a first face and a second face; and a plurality of through wires 12a, 12b formed by filling or depositing a conductive substance 27 in a through hole penetrating between a first face 1 and a second face 2. The through wires are separated from each other, and have at least one overlaid portion when seen from a plane of the substrate. The through wiring substrate manufacturing method includes: a step A for reforming a region, in which through holes are formed, by radiating lasers from the first face side or the second face side of the substrate; and a step B for forming the through holes by removing the reformed region. In the step A, after the overlaid portion farther from an incident face of the laser is irradiated with lasers among the plural through hole formation regions, the overlaid portion nearer the incident face of the laser is irradiated with lasers. <P>COPYRIGHT: (C)2012,JPO&INPIT |
