发明名称 EJECTABLE COMPONENT ASSEMBLIES IN ELECTRONIC DEVICES
摘要 Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves.
申请公布号 US2012176753(A1) 申请公布日期 2012.07.12
申请号 US201213429563 申请日期 2012.03.26
申请人 WANG ERIK L.;MURPHY SEAN;TAN TANG YEW;NEAVES JEFFREY EUGENE;DAVIS LAWRENCE E.;KIM SUNG;APPLE INC. 发明人 WANG ERIK L.;MURPHY SEAN;TAN TANG YEW;NEAVES JEFFREY EUGENE;DAVIS LAWRENCE E.;KIM SUNG
分类号 H05K1/18;H05K7/00 主分类号 H05K1/18
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