| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a powder composition which reduces thermal resistance particularly in a thickness direction by maintaining productivity of a thermal conductive pressure-sensitive adhesive composition or a thermal conductive pressure-sensitive sheet molding, and the thermal conductive pressure-sensitive adhesive composition and the thermal conductive pressure-sensitive sheet molding, including the powder composition, a method for manufacturing the same, and an electronic component including the thermal conductive pressure-sensitive adhesive composition, or the thermal conductive pressure-sensitive adhesive sheet molding. <P>SOLUTION: The powder composition is formed by polymerlization and cross-linking reaction of a (meth)acrylic ester monomer mixture in a mixture composition with a (meth)acrylic resin composition including a (meth)acrylic acid ester polymer and the (meth)acrylic acid ester monomer mixture, and expanded graphite powder of an average particle diameter of 60 μm or more, and 500 μm or less. The thermal conductive pressure-sensitive adhesive composition and the thermal conductive pressure-sensitive adhesive sheet molding, including the powder composition, the method for manufacturing the same, and the electronic component including the thermal conductive pressure-sensitive adhesive composition, and the thermal conductive pressure-sensitive adhesive sheet molding, are provided. <P>COPYRIGHT: (C)2012,JPO&INPIT |
