| 摘要 |
PROBLEM TO BE SOLVED: To obtain a high dimension accuracy with a simple process, to suppress generation of flaws such as a water mark or the like by reducing liquid residue after liquid treatment, and to keep a wafer in a stable condition, thereby improving throughput. SOLUTION: A substrate processing apparatus has a wafer boat which serves as a transportation means that transports a semiconductor wafer W while the semiconductor wafer W is held vertically by a plurality of holding bodies. The wafer boat 5 has a lower holder 20 supporting a lower end of the wafer, and a matched pair of upper holding bodies 30 supporting a lower side end of the wafer. At least one holder consists of substantially V-shaped holding grooves 21 and 31 that incline at a predetermined angle to a longitudinal direction of the holder. One surface of the wafer is held at a first slope 41 configuring the holding groove, and the other surface of the wafer is held at a second slope configuring the holding groove. COPYRIGHT: (C)2010,JPO&INPIT |
