| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To perform reflow soldering surely and quickly by making the atmospheric temperature constant. <P>SOLUTION: A reflow soldering method for mounting a component on a flexible printed wiring board which employs synthetic resin as a base by irradiating solder with a laser beam comprises a step for arranging a porous plate having a laser light transmission surface at a predetermined height in a small chamber subjected to temperature management and then mounting a flexible printed wiring board on the porous plate, a step for preheating solder arranged on the flexible printed wiring board in the small chamber subjected to temperature management and sucking heat in the small chamber from below the porous plate, and a step for irradiating the solder with a laser beam from the outside of the small chamber. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
