Vertical mount transient voltage suppressor array

摘要

A system (10) comprises a package (12) with top (22) and bottom (24) surfaces, a plurality of high-power transient voltage suppressors (15) arranged within the package, and a robust lead frame (16). Each of the transient voltage suppressors (15) has first and second major surfaces substantially perpendicular to the top (22) and bottom surfaces (24) of the package. The lead frame (16) comprises leads (18A,18B) connected to the major surfaces of the transient voltage suppressors. Each of the leads has a thickness greater than about 0.015 inches (0.381 mm) in a mounting portion (36), in order to dissipate heat from the transient voltage suppressors (15) and to resist vibration-induced stress on the package.