THE TRANSPARENT POLYIMIDE SUBSTRATE AND THE METHOD FOR PRODUCING IT

摘要

PURPOSE: A transparent polyimide substrate and a manufacturing method thereof are provided to enhance solvent resistance and thermal resistance of polyimide film surfaces by forming an inorganic silicon oxide layer on one side or both sides of transparent polyimide films. CONSTITUTION: A transparent polyimide substrate comprises transparency polyimide films and a silicon oxide layer. The silicon oxide layers are formed on a single-side or both sides of the transparent polyimide film and comprises silicon oxide consisting of units represented by chemical formula. In the chemical formula 1, m and n are respectively integers of 0-10. The thickness of the silicon oxide layer is 0.3-2.0 micro meters. The surface roughness(RMS) of the silicon oxide layer is 5 nano meters or less. A manufacturing method of transparent polyimide substrate comprises the following steps: coating and drying a solution including polysilazane on a single-side or both sides of the transparent polyimide film; and curing the coated polysilazane.