TRANSPARENT RESIN FOR ENCAPSULATION MATERIAL AND ENCAPSULATION MATERIAL AND ELECTRONIC DEVICE INCLUDING THE SAME

摘要

PURPOSE: A transparent resin for encapsulant resin is provided to improve physical properties of a transparent resin, thereby increasing processability, while preventing the degradation of luminous efficiency. CONSTITUTION: A transparent resin for encapsulant resin comprises a first polysiloxane having silicon-bonded hydrogen(Si-H) in terminal, and a second polysiloxane having a silicon-bonded alkenyl group(Si-Vi) in terminal. The ratio(Si-H/Si-Vi) of alkenyl group(Si-Vi) to the silicon-bonded hydrogen(Si-H) is 1-1.2. The sealant is obtained by curing the transparent resin for encapsulant. The encapsulant has transmittancy(T) of 80-100% in 450nm wavelength, and has reduction of transmittancy(ΔT) after heating at 120°C for 500 hours is lower than 15%.