发明名称 |
Micro electro-mechanical system packaging and interconnect |
摘要 |
A micro electro-mechanical system (MEMS) device includes an electrical wafer, a mechanical wafer, a plasma treated oxide seal bonding the electrical wafer to the mechanical wafer, and an electrical interconnect between the electrical wafer and the mechanical wafer. |
申请公布号 |
US8217473(B2) |
申请公布日期 |
2012.07.10 |
申请号 |
US20050192945 |
申请日期 |
2005.07.29 |
申请人 |
CHEN CHIEN-HUA;BAMBER JOHN;KANG HENRY;HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
CHEN CHIEN-HUA;BAMBER JOHN;KANG HENRY |
分类号 |
H01L27/14 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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