HETEROJUNCTION STRUCTURES OF DIFFERENT SUBSTRATES JOINED AND METHODS FOR FABRICATING THE SAME

摘要

PURPOSE: A junction structure and method for heterogeneous substrates are provided to improve electrical characteristics by making electrically good connection of the heterogeneous substrates. CONSTITUTION: A first substrate(100) includes an electrode pad. A second substrate is bonded with the first substrate while a bonding layer is interposed. The second substrate comprises via holes(120, 130) exposing an electrode pad through the first substrate and the bonding layer. Connecting electrodes(520, 530) connect the electrode pad in the via hole. An insulating layer(400) electrically insulates a connection electrode from the second substrate. The first and second substrates have different thermal expansion coefficients. The bonding layer and the insulating layer include an organic material.