PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME

摘要

PURPOSE: A printed circuit board and a semiconductor package including the same are provided to prevent the bending of a semiconductor package by setting different heat expansion coefficients for first and second sub core layers of a printed circuit board. CONSTITUTION: A printed circuit board(1) comprises a core layer(10), an upper wiring layer(20), and a lower wiring layer(30). The core layer comprises a first sub core layer(11) and a second sub core layer(12). The upper wiring layer, which includes an upper circuit pattern(22) formed in an upper insulating layer(21) and an upper connection pad(23) electrically connected to the upper circuit pattern, is formed on the top of the core layer. The lower wiring layer, which includes a lower circuit pattern(32) formed in a lower insulating layer(31) and a lower connection pad(33) electrically connected to the lower circuit pattern, is formed at the bottom of the core layer.