发明名称 Substrate support bushing
摘要 An apparatus for supporting a substrate within a processing chamber is provided. In one aspect, a substrate support member is provided comprising a housing having a bore formed therethrough, a support pin at least partially disposed within the bore, and a plurality of bearing elements disposed about the housing. In one aspect, the bearing elements comprise a roller having a central bore formed therethrough, a contoured outer surface, and a shaft at least partially disposed through the central bore. In another aspect, the bearing elements comprise a ball assembly comprising a larger spherical member and four smaller spherical members arranged about the larger spherical member.
申请公布号 US8216422(B2) 申请公布日期 2012.07.10
申请号 US20050044245 申请日期 2005.01.27
申请人 KURITA SHINICHI;ANWAR SUHAIL;KIYOTAKE TOSHIO;APPLIED MATERIALS, INC. 发明人 KURITA SHINICHI;ANWAR SUHAIL;KIYOTAKE TOSHIO
分类号 C23C16/00;H01L21/68;B65G49/06;C03C17/00;C23C16/458;F16C29/00;F16C29/04;G01V8/00;H01L21/00;H01L21/205;H01L21/3065;H01L21/683 主分类号 C23C16/00
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