发明名称 Thermosetting resin composition
摘要 A thermosetting resins composite, composed of: epoxy resin which can have a total polymerization with bismaleimide, occupying 1.75%-18.0% solids weight of the composite; bismaleimide compounds, occupying 0.15%-12.5% solids weight of the composite; free radical initiator, its mole fraction of which its addition accounts for reaction monomer total is 0.01%-0.15%; inhibitor, whose amount is the half to double of the initiator; styrene-maleic anhydride copolymers, occupying 17.5%-47.0% solids weight of the composite; filler, occupying 20%-60% solids weight of the composite; solvent, occupying 30%-50% solids weight of the composite; flame retardant which can be used in CCL industries.
申请公布号 US8217099(B2) 申请公布日期 2012.07.10
申请号 US20080125430 申请日期 2008.05.22
申请人 HE YUFANG;SU LIJUN;ITEQ (DONGGUAN) CORPORATION;ITEQ CORPORATION 发明人 HE YUFANG;SU LIJUN
分类号 C08L63/00;C08K3/20;C08K3/22;C08K3/28;C08K3/34;C08K3/36;C08K3/38;C08K3/40;C08L25/04 主分类号 C08L63/00
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