| 摘要 |
PURPOSE: An epoxy resin composition for sealing a semiconductor device is provided to have excellent moldability, and to have low contamination of a mold and a package, thereby having excellent crack resistance of a package, and excellent continuous moldability. CONSTITUTION: An epoxy resin composition for sealing a semiconductor device comprises an epoxy resin, a hardener, a curing accelerator, an inorganic filler, and additives, and comprises polyethylene-based wax comprising a compound in chemical formula 1, and cyclic diphosphate based compound in chemical formula 2, as the additives. In chemical formula 1, n is an integer from 30-450. In chemical formula 2, R1 and R2 are respectively one or more kinds selected from a group consisting of a C1-30 linear or branched alkyl group, a C1-30 linear or branched alkenyl group, a C1-30 linear or branched alkynyl group, and a C6-20 aryl group.
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