SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package structure and a manufacturing method thereof are provided to reduce thickness of a semiconductor package by packing a pad of two semiconductor dies to be exposed to outside. CONSTITUTION: A first semiconductor die(10) comprises a first side(12) and a second side(14). A second semiconductor die(20) comprises a third side(22) and a fourth side(24). A fixing member(18) is formed between the first semiconductor die and the second semiconductor die. A third semiconductor die(40) is formed on the second semiconductor die. A mold(28) protects the side of the first semiconductor die, the second semiconductor die, and the fixing member. A first wire is formed on the first side and is electrically connected with a first pad. A second wire is formed on the second side and is electrically connected with a second pad.