| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip which can be obtained using a laser processing method that allows for high accuracy cutting of a processed article along a scheduled cut line. <P>SOLUTION: The chip 25 has a side surface 25a which is substantially parallel with the thickness direction. On the side surface 25a, melt processing regions 13<SB POS="POST">1</SB>, 13<SB POS="POST">2</SB>arranged in the thickness direction, and a melt processing region 13<SB POS="POST">3</SB>located between the melt processing regions 13<SB POS="POST">1</SB>, 13<SB POS="POST">2</SB>and having the length in the thickness direction shorter than that of the melt processing regions 13<SB POS="POST">1</SB>, 13<SB POS="POST">2</SB>are formed. On the side surface 25a, a plurality of wallner lines 24 are also formed continuously at least between the melt processing regions 13<SB POS="POST">1</SB>, 13<SB POS="POST">2</SB>to extend while inclining to the same side for the thickness direction. <P>COPYRIGHT: (C)2012,JPO&INPIT |
