SEMICONDUCTOR MODULE, MOULD DEVICE, AND MOULD-FORMING METHOD

摘要

Provided is a semiconductor module which comprises: a plurality of semiconductor elements; a planar first electrode joined to one surface side of the plurality of semiconductor elements; a planar second electrode joined to the other surface side of the plurality of semiconductor elements; and a mould material for sealing the plurality of semiconductor elements between the first electrode and the second electrode. A protruding section is provided at the peripheral edge section of the first electrode and extends towards the second electrode, and the protruding section encloses the mould material.