| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a thin, flexible and conductive paper substrate which is used for formation of an electronic circuit by a conductive ink containing a metal complex and can be disposed easily. <P>SOLUTION: In the method of manufacturing a conductive substrate using a conductive ink containing a metal complex, the substrate uses a paper base material prepared so that the Oken-type air permeability based on the JAPANTAPPI paper pulp test method No.5-2:2000 is 40000 sec or higher. <P>COPYRIGHT: (C)2012,JPO&INPIT |
