发明名称 SENSOR BRIDGE WITH OPENING TO BE THERMALLY SEPARATED
摘要 <P>PROBLEM TO BE SOLVED: To reduce power consumption and/or improve performance characteristics of a sensor in order to help increase of sensitivity and/or a dynamic range regarding the sensor with a sensor bridge which is supported on a substrate. <P>SOLUTION: Many openings (34, 36, 38, 40, 42, 44) to be thermally isolated are provided to a sensor bridge, and a sensor bridge (32) is thermally isolated from a substrate (20). A heating element (26), an upstream sensor element (22), and/or a downstream sensor element (24) are provided on the sensor bridge (32). A plurality of openings (34, 36, 38, 40, 42, 44) extend by passing through the sensor bridge (32), the heating element (26), the upstream and the downstream sensor elements (22, 24) are thermally isolated from the substrate (20) and/or from each other. The plurality of openings (34, 36, 38, 40, 42, 44) are substantially made into the round shape, the oval shape, the rectangular shape, and/or other suitable shapes. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012127965(A) 申请公布日期 2012.07.05
申请号 JP20110273724 申请日期 2011.12.14
申请人 HONEYWELL INTERNATL INC 发明人 BRIAN SPELDRICH
分类号 G01F1/692 主分类号 G01F1/692
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