| 摘要 |
Provided is an interposer which, when placed between two heat sources, is capable of more effectively suppressing thermal conduction between the heat sources. An interposer (24) is provided with: a body having a cavity (23) maintained in a vacuum state; insulating layers (22a, 22b) respectively formed in an upper wall (20a) and lower wall (20b) of the body; and heat reflecting layers (21a, 21b) respectively formed on the insulating layers (22a, 22b). The interposer (24) thermally insulates between semiconductor devices (11a, 12a) mounted above and below the interposer. |
