| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for producing a wafer which can effectively chamfer a wafer and form a mark representing a crystal orientation. <P>SOLUTION: A columnar crystal ingot 1 in which an edge face is a circle having a diameter of not more than 1.0 inch, is formed and then on a circumference of the crystal ingot 1 a chamfer groove 12 is formed at intervals corresponding to a thickness of one wafer W, while a plane parallel to a tangent surface is formed on the circumference of the crystal ingot 1 as a mark representing a crystal orientation. Next, the crystal ingot is cut and sliced along the chamfer groove 12 by a wire saw 4 to obtain wafer. Because the chamfer groove and the mark representing the crystal orientation are formed before cutting out the wafer, a chamfer process and a marking process for wafers piece by piece is unnecessary and the productivity can be improved. <P>COPYRIGHT: (C)2012,JPO&INPIT |
