| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a Cu-Ni-Si-Co-based alloy strip excellent in balance between strength and electrical conductivity, capable of controlling sagging and curling. <P>SOLUTION: This copper alloy strip for an electronic material includes 1.0-2.5 mass% Ni, 0.5-2.5 mass% Co, 0.3-1.2 mass% Si, and a remainder consisting of Cu and inevitable impurities. The copper alloy strip satisfies both of following conditions (a) and (b), according to a result obtained by X-ray diffraction pole figure measurement: (a) a peak height at the β angle of 145° in diffraction peak intensities by β scanning at α=20° in ä200} pole figure is ≤5.2 times of that of standard copper powder; (b) a peak height at the β angle of 185° in diffraction peak intensities by β scanning at α=75° in ä111} pole figure is ≥3.4 times of that of the standard copper powder. <P>COPYRIGHT: (C)2012,JPO&INPIT |
