PHOTOCURABLE RESIN COMPOSITION

摘要

Provided is a photocurable resin composition which contains a carboxyl group-containing resin, a photopolymerization initiator, a naphthalene derivative and/or naphthoquinone, and a derivative thereof, so as to prevent halation and undercutting, obtain stable high resolution, and inhibit the generation of cracks in thermal cycles. Preferably, the naphthalene derivative and/or the naphthoquinone and the derivative thereof are compounds having a hydroxyl group. The photocurable resin composition or a dry film thereof can be suitably used for forming a cured film such as a solder resist which is excellent in terms of various properties such as TCT resistance and PCT resistance for a printed wiring board and a flexible printed wiring board.