METHOD FOR MANUFACTURING CU WIRE PLATED PD

摘要

PURPOSE: A method for manufacturing a copper wire plated with palladium is provided to implement plating at relatively low current density by repetitively inserting and taking a copper wire in and out of a palladium plating bath. CONSTITUTION: A method for manufacturing a copper wire plated with palladium comprises the steps of: preparing a copper wire(S10), dipping the copper wire in a palladium plating bath(S30), and performing palladium plating on the top of the copper wire through pulse-reverse electroplating comprising a forward current period of 1-100msec and an off current period of 0.1-10msec.