METHOD OF COUPLING SEMICONDUCTOR STRUCTURES DIRECTLY TO EACH OTHER, AND COUPLED SEMICONDUCTOR STRUCTURE FORMED BY USING THAT METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method of coupling semiconductor structures directly to each other.

SOLUTION: A method of coupling semiconductor structures directly to each other is provided. A cap layer can be provided on the interface between the directly coupled metal features of a semiconductor structure. Impurities are provided in the directly coupled metal features of a semiconductor structure. A coupled semiconductor structure is formed using such a method.

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