发明名称 WIRING FORMATION DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To form continuously stable wiring for a long time. <P>SOLUTION: A wiring forming device forms a wiring pattern by supplying a paste material onto an insulating substrate by a paste material applying device. The paste material applying device includes: an atomization device atomizing the paste material; and a nozzle for spraying the paste material atomized by the atomization device onto the insulating substrate. The atomization device includes: a solvent supply part mixing gas obtained by atomizing solvent with carrier gas and supplying it to the atomization part; an atomizing part atomizing paste solvent, taking it into mixed gas from the solvent supply part and making a mist flow; and a mixing ratio adjusting device adjusting a mixing ratio of the mist flow. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012129413(A) 申请公布日期 2012.07.05
申请号 JP20100280847 申请日期 2010.12.16
申请人 MICRONICS JAPAN CO LTD 发明人 TANAKA KATSUMI;SHINOZAKI KENICHI;OKUMURA TETSUYA;KIKUTA MAKOTO;SANO MASAKI;MOGI TARO
分类号 H05K3/10;B05B7/04 主分类号 H05K3/10
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