| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide fine spherical copper powder having a narrow particle size distribution and suitable for a conductive filler, and to provide a method for producing the same. <P>SOLUTION: The fine spherical copper powder is obtained by a disproportionation reaction and has an average particle diameter of 0.25 μm as measured by a laser diffraction particle size distribution measurement apparatus where a powder particle diameter has only one peak. A cuprous oxide is added to an aqueous medium containing a gum arabic additive to make a slurry which is kept at room temperature or lower. A dilute sulfuric acid at a temperature of room temperature or lower is added to the slurry at a time within 5 sec, and the disproportionation reaction is accomplished after 10 min to obtain the fine copper powder. <P>COPYRIGHT: (C)2012,JPO&INPIT |
