Contacting of construction elements on substrates

摘要

The circuit arrangement has carrier (10) having electric conductor tracks (16) and semiconductor device such as optoelectronic component e.g. optical application-specific integrated circuit (ASIC) (11), which is electrically conductively connected to the electrical conductor tracks of the carrier. The semiconductor device comprises a photosensitive surface (12) which is arranged on the side facing away from the carrier, and is exposed through silicon-via hole (13) so as to directly connect with the carrier. Independent claims are included for the following: (1) microelectronic assembly; and (2) optical device for transmitting and/or for receiving optical signals.