| 摘要 |
PURPOSE: A silver plating solution, a printed circuit board, and a manufacturing method thereof are provided to form a thick silver layer with soldability and wire bondability by employing electroless reduction. CONSTITUTION: A silver plating solution comprises a first solution and a second solution. The first solution includes silver ion, complexing agent, and pH control agent. The second solution includes reductant, which is detached after delivering electron to the silver ion of the first solution, and pH control agent. The silver ion includes AgNO_3,(NH_4)_2SO_4 and NH_4OH. |
