发明名称 |
(SPUTTERING TARGET)-(BUCKING PLATE) JOINT BODY, AND PROCESS FOR PRODUCTION THEREOF |
摘要 |
<p>A sputtering target-backing plate assembly obtained by bonding a target material of Mg to a backing plate of Cu—Cr alloy, wherein the target material and the backing plate are bonded via a layer of Ni or an alloy comprising Ni as a main component at the interface therebetween. An object of the present invention is to provide a sputtering target-backing plate assembly that is used when magnesium (Mg) is the sputtering target material, and to resolve problems inherent in magnesium (Mg) and problems related to the selection of a backing plate to be compatible with magnesium by improving the bonding strength between the target and the backing plate in order to improve the sputtering efficiency.</p> |
申请公布号 |
KR20120070607(A) |
申请公布日期 |
2012.06.29 |
申请号 |
KR20127012881 |
申请日期 |
2010.10.04 |
申请人 |
JX NIPPON MINING & METALS CORPORATION |
发明人 |
KOIDO YOSHIMASA |
分类号 |
C23C14/34;B23K35/30;C22C9/00;C22C19/05 |
主分类号 |
C23C14/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|