| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem in which a module is determined to be defective due to poor connection between the module and a main side connector. <P>SOLUTION: A server 100 comprises; a connector 20 to which a memory device 10 is connected through multiple contact points and data of multiple bits is inputted from the memory device 10 through the multiple contact points; a bit error detection part 41 determining whether or not an error is raised in a bit included in the data of multiple bits inputted through the connector 20; a connection confirmation circuit 50 determining a state of first wiring by inputting a test waveform to the first wiring including the contact point corresponding to the bit in which the error was detected by the bit error detection part 41 and second wiring including the contact point corresponding to the bit in which the error was not detected by the bit error detection part 41, and evaluating level difference of reflection waves raised in each of the first and second wiring corresponding to the test waveform. <P>COPYRIGHT: (C)2012,JPO&INPIT |
