HEAT DISSIPATION DEVICE AND METHOD FOR MANUFACTURING SAME

摘要

An exemplary heat dissipation device includes a base plate and heat pipes. The base plate defines recesses at one side surface and locating holes communicating with the recesses. The heat pipes each include an evaporating section received in a corresponding recess and a condensing section extending from the evaporating section. The evaporating section includes a bulge protruding outward from an outer surface thereof. The evaporating sections of the heat pipes are interference fitted in the recesses with the bulges protruding into the locating holes.