LIGHT EMITTING DIODE CHIP AND METHOD OF FABRICATING THE SAME
摘要
<p>Exemplary embodiments of the present invention provide light emitting diode (LED) chips and a method of fabricating the same. An LED chip according to an exemplary embodiment includes a substrate; a light emitting structure arranged on the substrate, and an alternating lamination bottom structure arranged under the substrate. The alternating lamination bottom structure includes a plurality of dielectric pairs, each of the dielectric pairs including a first material layer having a first refractive index and a second material layer having a second refractive index, the first refractive index being greater than the second refractive index.</p>
申请公布号
WO2012086888(A1)
申请公布日期
2012.06.28
申请号
WO2011KR04314
申请日期
2011.06.13
申请人
SEOUL OPTO DEVICE CO., LTD.;HEO, MIN CHAN;JIN, SANG KI;KIM, JONG KYU;SHIN, JIN CHEOL;LEE, SO RA;LEE, SUM GEUN
发明人
HEO, MIN CHAN;JIN, SANG KI;KIM, JONG KYU;SHIN, JIN CHEOL;LEE, SO RA;LEE, SUM GEUN