LEAD FRAME OR SUBSTRATE FOR LED AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a lead frame or a substrate for an LED and method of manufacturing the same, and a semiconductor device and a method of manufacturing the same, capable of enhancing the heat resistance and thinning a layer between a reflection metal layer and a main body.

SOLUTION: A lead frame or a substrate 10 for an LED has: a main body 11 having a mounting surface 11a on which an LED element 21 is mounted; and a reflection metal layer 12 provided on the mounting surface 11a of the main body 11 and functioning as a reflection layer for reflecting light from the LED element 21. The reflection metal layer 12 is made of an alloy of gold and silver or an alloy of platinum and silver. The main body 11 is made of copper or a copper alloy. An intermediate layer 15 is provided between the reflection metal layer 12 and the main body 11. The intermediate layer 15 has a nickel layer 17 and a gold layer 18 arranged from the main body 11 side sequentially.

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