| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for inserting an IC sheet in a booklet by which a thermoplastic resin material does not melt to protrude from between the IC sheet and a paper page when holding the IC sheet covered by the resin between the paper pages of a booklet to superpose, and heating and pressurizing the paper page of the booklet superposed with the IC sheet to perform bonding by thermal fusion. <P>SOLUTION: The method for inserting the IC sheet in two-paginated booklet includes the processes of: feeding the two-paginated booklet; opening the booklet; inserting, between page covers turned over in a V form, the IC sheet which has the long and short side dimensions shorter than those of page covers; inserting a page-holding plate; performing thermocompression; cooling; collecting the page-holding plate; and performing a booklet accumulation. <P>COPYRIGHT: (C)2012,JPO&INPIT |
